1st Rapperswil International Bonding Forum
Type of event: Offline event
The RIBF 2018 will take place at the HSR University of Applied Sciences Rapperswil, Switzerland on 27. June 2018. The conference focuses on bonding technology and especially on applied research and industrial applications.
The RIBF 2018 conference focuses on bonding technology. The first event of this conference aims at bringing together engineers and researchers from the Industry, Engineering Schools and Universities, to exchange about the state of the art and the latest innovations in the field of bonding technology. The contents of the conference focuses on applied research and industrial applications.
RIBF 2018 focuses especially on the topics of joint design for industrial applications, mechanical properties of adhesive joints including experimental aspects and numerical studies, adhesion and surface treatments, quality procedures and standardisation.
With a program of 20 presentations followed by a visit of the lab facilities of our Institute, the IWK, the conference offers the possibility to discover the state of the art as well as the last innovations in the frame of bonding technology.
The conference language is English. Presentations will be held in English.
We look forward to welcoming you in Rapperswil.
Prof. Dr. Pierre Jousset
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